The heat dissipation mechanism of the LED lamp The heat generated by the LED chip is finally dissipated into the air through the luminaire, and its heat dissipation structure. Specifically, the heat generated by the LED chip is conducted from the lower metal heat sink block, passes through the solder to the PCB of the aluminum substrate, passes through the thermal conductive adhesive to the heat sink, and is finally transferred to the air. The thermal conductivity of each part can be explained by the thermal resistance. Heat is like electric charge. Heat flows like electric current. When it flows, it will encounter resistance, just like resistance. Here we call it thermal resistance. The unit of thermal resistance is how many degrees per watt, that is, how much the power will rise every watt. If you know the power you need to dissipate and know its thermal resistance, you can know what its temperature rise is. The greater the thermal resistance, the lower the heat, the higher the temperature rise, the smaller the thermal resistance, the faster the heat flow, and the temperature rise is the effective material for enhancing the heat exchange of the foam metal LED lamp radiator. Applying foam metal to LED heat sinks, LEDs will increasingly be used in public lighting and lighting in harsh environments.

The total thermal resistance from the chip to the air is: as long as the total thermal resistance from the chip to the air is known, the junction temperature can be calculated according to the dissipated power: Tj is the junction temperature in the above formula (in the actual semiconductor chip in the electronic device) The highest temperature), Pd is the power dissipation, Rj1 is the thermal resistance from the chip to the mounting substrate (thermal resistance of the chip); Rj2 is the thermal resistance of the solder; Rj3 is the thermal resistance of the aluminum substrate; Rj4 is the thermal resistance of the thermal silica gel; Rj5 is the thermal resistance from the heat sink to the air; Ta is the assumed ambient temperature. In actual lamps, the thermal resistance is much higher than this, and the thermal resistance of the bonding material between the parts is considered, and there is a residual air gap. And the most difficult to estimate is Rj5, which is the heat resistance of the radiator to the air, which involves many heat dissipation mechanisms related to convection and radiation.

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